Part Number Hot Search : 
HT45F23A OSM57 2SB140 MO51C 10M000 2SA1390 MJD117G MC143
Product Description
Full Text Search
 

To Download SPP16N50C3-09 Datasheet File

  If you can't view the Datasheet, Please click here to try to view without PDF Reader .  
 
 


  Datasheet File OCR Text:
  20 09-12-22 rev. 3.2 p age 1 spp16n50c3 spi16n50c3, spa16n50c3 cool mos? power transistor v ds @ t jmax 560 v r ds(on) 0.28 ? i d 16 a feature ? new revolutionary high voltage technology ? ultra low gate charge ? periodic avalanche rated ? extreme d v /d t rated ? ultra low effective capacitances ? improved transconductance ? p g -to-220-3-31;-3-111: fully isolated package (2500 vac; 1 minute) pg-to220fp pg-to220 p g -to26 2 2 p - to220 - 3 - 1 2 3 1 p-to220-3-31 1 2 3 marking 16n50c3 16n50c3 16n50c3 type package ordering code spp16n50c3 p g -to220 q67040-s4583 spi16n50c3 p g -to262 q67040-s4582 spa16n50c3 p g -to220 fp sp000216351 maximum ratings parameter symbol value unit spp_i spa continuous drain current t c = 25 c t c = 100 c i d 16 10 16 1) 10 1) a pulsed drain current, t p limited by t j ma x i d p uls 48 48 a avalanche energy, single pulse i d =8, v dd =50v e as 460 460 mj avalanche energy, repetitive t ar limited by t jmax 2) i d =16a, v dd =50v e ar 0.64 0.64 avalanche current, repetitive t ar limited by t j ma x i a r 16 16 a gate source voltage v gs 20 20 v gate source voltage ac (f >1hz) v gs 30 30 power dissipation, t c = 25c p tot 160 34 w operating and storage temperature t j , t st g -55...+150 c reverse diode dv/dt dv/dt 15 v/ns 6)
200 9-12-22 rev. 3.2 p age 2 spp16n50c3 spi16n50c3, spa16n50c3 maximum ratings parameter symbol value unit drain source voltage slope v ds = 400 v, i d = 16 a, t j = 125 c d v /d t 50 v/ns thermal characteristics parameter symbol values unit min. typ. max. thermal resistance, junction - case r thjc - - 0.78 k/w thermal resistance, junction - case, fullpak r thjc_fp - - 3.7 thermal resistance, junction - ambient, leaded r thja - - 62 thermal resistance, junction - ambient, fullpak r thja fp - - 80 soldering temperature, wavesoldering 1.6 mm (0.063 in.) from case for 10s 3) t sold - - 260 c electrical characteristics, at t j =25c unless otherwise specified parameter symbol conditions values unit min. typ. max. drain-source breakdown voltage v (br)dss v gs =0v, i d =0.25ma 500 - - v drain-source avalanche breakdown voltage v (br)ds v gs =0v, i d =16a - 600 - gate threshold voltage v gs(th) i d =675 a, v gs =v ds 2.1 3 3.9 zero gate voltage drain current i dss v ds =500v, v gs =0v, t j =25c t j =150c - - 0.1 - 1 100 a gate-source leakage current i gss v gs =20v, v ds =0v - - 100 na drain-source on-state resistance r ds(on) v gs =10v, i d =10a t j =25c t j =150c - - 0.25 0.68 0.28 - ? gate input resistance r g f =1mhz, open drain - 1.5 -
200 9-12-22 rev. 3.2 p age 3 spp16n50c3 spi16n50c3, spa16n50c3 electrical characteristics , at t j = 25 c, unless otherwise specified parameter symbol conditions values unit min. typ. max. characteristics transconductance g fs v ds 2* i d * r ds(on)max , i d =10a - 14 - s input capacitance c iss v gs =0v, v ds =25v, f =1mhz - 1600 - pf output capacitance c oss - 800 - reverse transfer capacitance c rss - 30 - effective output capacitance, 4) energy related c o(er) v gs =0v, v ds =0v to 400v - 64 - effective output capacitance, 5) time related c o(tr) - 124 - turn-on delay time t d(on) v dd =380v, v gs =0/10v, i d =16a, r g =4.3 ? - 10 - ns rise time t r - 8 - turn-off delay time t d(off) - 50 - fall time t f - 8 - gate charge characteristics gate to source charge q gs v dd =380v, i d =16a - 7 - nc gate to drain charge q gd - 36 - gate charge total q g v dd =380v, i d =16a, v gs =0 to 10v - 66 - gate plateau voltage v (plateau) v dd =380v, i d =16a - 5 - v 1 limited only by maximum temperature 2 repetitve avalanche causes additional power losses that can be calculated as p av = e ar * f . 3 soldering temperature for to-263: 220c, reflow 4 c o(er) is a fixed capacitance that gives the same stored energy as c oss while v ds is rising from 0 to 80% v dss . 5 c o(tr) is a fixed capacitance that gives the same charging time as c oss while v ds is rising from 0 to 80% v dss . 6 i sd <=i d , di/dt<=400a/us, v dclink =400v, v peak 200 9-12-22 rev. 3.2 p age 4 spp16n50c3 spi16n50c3, spa16n50c3 electrical characteristics parameter symbol conditions values unit min. typ. max. inverse diode continuous forward current i s t c =25c - - 16 a inverse diode direct current, pulsed i sm - - 48 inverse diode forward voltage v sd v gs =0v, i f = i s - 1 1.2 v reverse recovery time t rr v r =380v, i f = i s , d i f /d t =100a/s - 420 - ns reverse recovery charge q rr - 7 - c peak reverse recovery current i rrm - 40 - a peak rate of fall of reverse recovery current di rr /dt t j =25c - 1100 - a/s typical transient thermal characteristics symbol value unit symbol value unit spp_i spa spp_i spa r th1 0.012 0.012 k/w c th1 0.0002495 0.0002495 ws/k r th2 0.023 0.023 c th2 0.0009406 0.0009406 r th3 0.043 0.043 c th3 0.001298 0.001298 r th4 0.149 0.176 c th4 0.00362 0.00362 r th5 0.17 0.371 c th5 0.009484 0.008025 r th6 0.069 2.522 c th6 0.077 0.412 external heatsink t j t case t amb c th1 c th2 r th1 r th,n c th,n p tot (t)
200 9-12-22 rev. 3.2 p age 5 spp16n50c3 spi16n50c3, spa16n50c3 1 power dissipation p tot = f ( t c ) 0 20 40 60 80 100 120 c 160 t c 0 20 40 60 80 100 120 140 w 170 spp16n50c3 p tot 2 power dissipation fullpak p tot = f ( t c ) 0 20 40 60 80 100 120 c 160 t c 0 4 8 12 16 20 24 28 w 36 p tot 3 safe operating area i d = f ( v ds ) parameter : d = 0 , t c =25c 10 0 10 1 10 2 10 3 v v ds -2 10 -1 10 0 10 1 10 2 10 a i d tp = 0.001 ms tp = 0.01 ms tp = 0.1 ms tp = 1 ms dc 4 safe operating area fullpak i d = f ( v ds ) parameter: d = 0, t c = 25c 10 0 10 1 10 2 10 3 v v ds -2 10 -1 10 0 10 1 10 2 10 a i d tp = 0.001 ms tp = 0.01 ms tp = 0.1 ms tp = 1 ms tp = 10 ms dc
200 9-12-22 rev. 3.2 p age 6 spp16n50c3 spi16n50c3, spa16n50c3 5 transient thermal impedance z thjc = f ( t p ) parameter: d = t p / t 10 -7 10 -6 10 -5 10 -4 10 -3 10 -1 s t p -4 10 -3 10 -2 10 -1 10 0 10 1 10 k/w z thjc d = 0.5 d = 0.2 d = 0.1 d = 0.05 d = 0.02 d = 0.01 single pulse 6 transient thermal impedance fullpak z thjc = f ( t p ) parameter: d = t p / t 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 1 s t p -4 10 -3 10 -2 10 -1 10 0 10 1 10 k/w z thjc d = 0.5 d = 0.2 d = 0.1 d = 0.05 d = 0.02 d = 0.01 single pulse 7 typ. output characteristic i d = f ( v ds ); t j =25c parameter: t p = 10 s, v gs 0 5 10 15 v 25 v ds 0 10 20 30 40 a 60 i d 4.5v 5v 5.5v 6v 20v 7v 6.5v 8 typ. output characteristic i d = f ( v ds ); t j =150c parameter: t p = 10 s, v gs 0 5 10 15 v 25 v ds 0 5 10 15 20 25 a 35 i d 5v 4v 4.5v 20v 7v 6v
200 9-12-22 rev. 3.2 p age 7 spp16n50c3 spi16n50c3, spa16n50c3 9 typ. drain-source on resistance r ds(on) = f ( i d ) parameter: t j =150c, v gs 0 5 10 15 20 a 30 i d 0 0.4 0.8 1.2 ? 2 r ds(on) 6v 5v 4.5v 4v 8v 20v 10 drain-source on-state resistance r ds(on) = f ( t j ) parameter : i d = 10 a, v gs = 10 v -60 -20 20 60 100 c 180 t j 0 0.2 0.4 0.6 0.8 1 1.2 ? 1.6 spp16n50c3 r ds(on) typ 98% 11 typ. transfer characteristics i d = f ( v gs ); v ds 2 x i d x r ds(on)max parameter: t p = 10 s 0 1 2 3 4 5 6 7 8 v 10 v gs 0 5 10 15 20 25 30 35 40 45 50 a 60 i d tj = 25c tj = 150c 12 typ. gate charge v gs = f ( q gate ) parameter: i d = 16 a pulsed 0 10 20 30 40 50 60 70 80 nc 100 q gate 0 2 4 6 8 10 12 v 16 spp16n50c3 v gs 0,8 v ds max ds max v 0,2
200 9-12-22 rev. 3.2 p age 8 spp16n50c3 spi16n50c3, spa16n50c3 13 forward characteristics of body diode i f = f (v sd ) parameter: t j , t p = 10 s 0 0.4 0.8 1.2 1.6 2 2.4 v 3 v sd -1 10 0 10 1 10 2 10 a spp16n50c3 i f t j = 25 c typ t j = 25 c (98%) t j = 150 c typ t j = 150 c (98%) 14 avalanche soa i ar = f ( t ar ) par.: t j 150 c 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 4 s t ar 0 2 4 6 8 10 12 a 16 i ar t j(start) = 25c t j(start) = 125c 15 avalanche energy e as = f ( t j ) par.: i d = 8 , v dd = 50 v 20 40 60 80 100 120 c 160 t j 0 0.1 0.2 0.3 mj 0.5 e as 16 drain-source breakdown voltage v (br)dss = f ( t j ) -60 -20 20 60 100 c 180 t j 450 460 470 480 490 500 510 520 530 540 550 560 570 v 600 spp16n50c3 v (br)dss
20 09-12-22 rev. 3.2 p age 9 spp16n50c 3 spi16n50c3, spa16n50c3 17 avalanche power losses p ar = f ( f ) parameter: e ar =0.64mj 10 2 10 3 10 4 10 5 10 6 hz f 0 50 100 150 200 250 300 350 w 450 p ar 18 typ. capacitances c = f ( v ds ) parameter: v gs =0v, f =1 mhz 0 100 200 300 v 500 v ds 0 10 1 10 2 10 3 10 4 10 pf c crss ciss coss 19 typ. c oss stored energy e oss = f ( v ds ) 0 100 200 300 v 500 v ds 0 1 2 3 4 5 6 7 j 9 e oss
200 9-12-22 rev. 3.2 p age 10 spp16n50c3 spi16n50c3, spa16n50c3 definition of diodes switching characteristics
200 9-12-22 rev. 3.2 p age 11 spp16n50c3 spi16n50c3, spa16n50c3 pg-to220-3-1, pg-to220-3-21
spp16n50c3 s pi 16 n5 0c3 , s pa 16 n5 0c3 pg-to220-3 (fully isolated) 24 dimensions in mm/ inches rev. 3.2 page 12 2009-12-20
200 9-1 2-22 rev. 3.2 p age 13 spp16n5 0c3 spi16n50c3, spa16n50c3 p g -to262-3-1, pg-to262-3-21 (i2-pak)
200 9-12-22 rev. 3.2 page 14 published by infineon technologies ag 81726 munich, germany ? 2007 infineon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non- infringement of intellectual property rights of any third party. information for further information on technology, deliver y terms and conditions and prices, please contact the nearest infineon technologies office ( www.infineon.com ). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon techno logies, if a failure of such components can reasonably be expected to cause the failure of th at life-support device or system or to affect the safety or effectiven ess of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is re asonable to assume that the health of the user or other persons may be endangered. spp16n50c3 spi16n50c3, spa16n50c3


▲Up To Search▲   

 
Price & Availability of SPP16N50C3-09

All Rights Reserved © IC-ON-LINE 2003 - 2022  

[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy]
Mirror Sites :  [www.datasheet.hk]   [www.maxim4u.com]  [www.ic-on-line.cn] [www.ic-on-line.com] [www.ic-on-line.net] [www.alldatasheet.com.cn] [www.gdcy.com]  [www.gdcy.net]


 . . . . .
  We use cookies to deliver the best possible web experience and assist with our advertising efforts. By continuing to use this site, you consent to the use of cookies. For more information on cookies, please take a look at our Privacy Policy. X